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自1876年成立以來，漢高旗下眾多品牌分別在個人消費及工業(yè)領域處于市場領先定位并享有美譽，比如寶瑩(Persil)、施華蔻(Schwarzkopf)、樂泰(Loctite)等。漢高Loctite?產品用于多種市場，例如電子、汽車、航空航天、機器制造和醫(yī)療設備以及多個通用工業(yè)領域。樂泰化工產品系列包括各種用于工業(yè)生產、工業(yè)維護以及汽車保養(yǎng)和維護的解決方案。漢高Loctite?生產線包括用于粘接接合處的潤滑劑、脫模劑、清潔劑和其他專用產品。

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產品分類：

The LOCTITE 4062 series Ethyl Cyanoacrylate Adhesive designed for bonding of plastics and elastomeric materials where very fast fixturing is required. The low viscosity is particularly suitable for bonding applications where controlled penetration of adhesive is required. Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24-hour before full chemical/solvent resistance is developed. The rate of cure will depend on the bondline gap. Thin bond lines result in high cure speeds, increasing the bond gap will decrease the rate of cure. Where cure speed is unacceptably long due to large gaps, applying activator to the surface will improve cure speed. However, this can reduce ultimate strength of the bond and therefore testing is recommended to confirm effect. . Very low viscosity . Humidity cure Not recommended for use in pure oxygen or oxygen rich system and should not be selected as a sealant for chlorine or other strong oxidizing materials.

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The 609973 is a no clean, clear residue cored Solder Wire designed to give fast and sustained wetting on both copper and brass. Multicore Crystal solid fluxes for cored solder wires have been specially formulated to complement No Clean wave and reflow soldering processes. It is also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicore Crystal 400 is designed for users who require a halide-free formulation while Crystal 500 contains a low level of halide. The remaining products in the range contain higher halide levels to maximise soldering power. . Halide free version, Crystal 400 . Fast soldering, range of activities to suit all applications . Good spread on copper, brass and nickel . Clear residues . Heat stable, low spitting . Mild odour

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產品分類：

The 904569 is a no clean cored Solder Wire contains a careful balance of resins and activators to provide minimal residues, high activity and good reliability without cleaning. Multicore X52 low residue solid flux has been specially formulated to complement no clean wave and reflow soldering processes where extra activity is required. It is also applicable to repair operations following a cleaning process to eliminate the need for further cleaning. Multicore X52 cored wire is manufactured as standard with a nominal flux content of 1% and are available in alloys Sn60 and Sn62 conforming to J-STD-006 and EN 29453 or alloys conforming to similar national and international standards and 99C lead-free alloy. The optimum tip temperature and heat capacity required for a hand soldering process is a function of the design of the iron and the task. . Eliminates cost of cleaning . Fast and sustained soldering on copper and brass . Non-corrosive formulation . Negligible residues

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99C 309 5C 1.20MM

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產品分類：

The 904557 is a no clean cored Solder Wire contains a careful balance of resins and activators to provide minimal residues, high activity and good reliability without cleaning. Multicore X52 low residue solid flux has been specially formulated to complement no clean wave and reflow soldering processes where extra activity is required. It is also applicable to repair operations following a cleaning process to eliminate the need for further cleaning. Multicore X52 cored wire is manufactured as standard with a nominal flux content of 1% and are available in alloys Sn60 and Sn62 conforming to J-STD-006 and EN 29453 or alloys conforming to similar national and international standards and 99C lead-free alloy. The optimum tip temperature and heat capacity required for a hand soldering process is a function of the design of the iron and the task. . Eliminates cost of cleaning . Fast and sustained soldering on copper and brass . Non-corrosive formulation . Negligible residues

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97SC HF212 AGS88,5 AF5 500G JAR

產品分類：

The 97SC HF212 AGS88,5 AF5 500G JAR is a grey 96.5/3/0.5 grade Solder Paste, Sn/Ag/Cu solder alloy. It features 217°C melting point. . Mild odour

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產品分類：

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